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Dr. Craig D. Hillman |
Member No. 40937 |
CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
 Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
Experts Questions Answered by Dr. Craig D. Hillman
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Jul 21, 2008 |
BGA Rework
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Apr 14, 2008 |
Determining Current Carrying Capacity
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Feb 4, 2008 |
Voiding after under-fill
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Feb 4, 2008 |
Lead Float
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Jan 28, 2008 |
Lower DPPM in PB free wave solder environment
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Jan 21, 2008 |
BGA bridging defects
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Jan 14, 2008 |
Lead Free Surface Finish
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Jan 7, 2008 |
Tg and Td for lead free process
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Jan 7, 2008 |
Resistivity and Cleaning
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Nov 12, 2007 |
The Role of Formic Acid
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Oct 22, 2007 |
Ultrasonic cleaning PCB's after wave solder
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Aug 27, 2007 |
Conformal Coating Specification Violation
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Jul 30, 2007 |
Scribe lines for depaneling boards
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Jul 24, 2007 |
Intermetallic Spalling
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Jul 16, 2007 |
Acceptable "reject rate" for hand assembly
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Jul 16, 2007 |
SMT adhesive problems after wave solder process
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May 29, 2007 |
Difference between ENIG and Flash?
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May 21, 2007 |
Socketed IC's
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May 14, 2007 |
Tin Whiskers
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Apr 2, 2007 |
Cleaning tin-lead and lead-free boards
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Mar 11, 2007 |
Rigid and flex board assembly
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Mar 4, 2007 |
Lead-free bar solder for wave soldering
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Feb 19, 2007 |
Wave solder and reflow 0805 capacitors and resistors
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Feb 12, 2007 |
HASL PCB's compared to OSP?
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Feb 4, 2007 |
Baking lead-free and lead PCB’s before assembly
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Jan 22, 2007 |
Small component rework
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Jan 22, 2007 |
Cleaning PCB Boards
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Jan 22, 2007 |
Double sided SMT
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Dec 11, 2006 |
Reflow and wave soldering OSP Boards
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Dec 4, 2006 |
Oxidation on plated through holes
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Nov 20, 2006 |
Lead levels in lead-free process
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Nov 20, 2006 |
0805 vs. 0603 availability
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Nov 20, 2006 |
Proper method to bake PCB's
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Nov 5, 2006 |
Copper Dissolution issue
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Oct 23, 2006 |
Reflow oven profilers
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Oct 16, 2006 |
Remove and replace a 240 pin connector
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Oct 9, 2006 |
Aqueous Cleaning Process
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Sep 18, 2006 |
Removing oxidation from partially assembled boards
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Sep 5, 2006 |
Help debugging wetting problems
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Aug 28, 2006 |
RoHS tantalum capacitors burning during functional test
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Aug 28, 2006 |
Small hole via plating reliability
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Aug 14, 2006 |
Coating to stop tin whisker growth?
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Aug 14, 2006 |
RoHS exemption for agricultural equipment in Europe
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Jun 29, 2006 |
Regarding lead free, can I use the reflow ovens I currently have in production?
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Jun 29, 2006 |
What should the average temperature and humidity level be in an electronic assembly facility?
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Jun 14, 2006 |
Pre-wash boards prior to conformal coating
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Jun 14, 2006 |
Concerned about "tin pest"
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Jun 1, 2006 |
RoHS compliance for SMT and Through-hole equipment
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May 25, 2006 |
AOI or X-Ray inspection?
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May 25, 2006 |
Failure at the ENIG finish on the BGA substrate
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May 25, 2006 |
What success have point to point robotic solder systems had meeting class 3?
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May 18, 2006 |
Is it possible to run Pb-Free reflow without nitrogen?
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May 18, 2006 |
Since we build to customer spec are we safe from Material Declaration?
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May 18, 2006 |
What alloy do you recommended for filters used with SAC305?
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May 10, 2006 |
Problems with defect BGA connections on large BGA's and on ENIG plated boards
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May 3, 2006 |
RoHS existing products vs. new products
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Apr 18, 2006 |
Standard pricing or estimating book for PCB design services
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Apr 18, 2006 |
Can PCB's designed for Sn/Pb be used in a Pb free assembly?
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