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Doug Dixon |
Member No. 40915 |
Electronics Global Marketing Manager
Henkel Corp
doug.dixon@us.henkel.com
 Mr. Dixon has been in the electronics field for over twenty years and is the Marketing Manager with the electronics group of Henkel. Prior to joining Henkel, he worked for Raytheon as a Manufacturing Process Engineer, Camalot Systems as a manager for the Applications/Product Development/Field Service departments, and Universal Instruments as a Product Manager.
Experts Questions Answered by Doug Dixon
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Aug 18, 2008 |
Voids in leadless packages
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Jun 16, 2008 |
Urethane Conformal Coating Problem
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Dec 3, 2007 |
Part Movement During Reflow
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Nov 5, 2007 |
Voids in BGA's
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Oct 29, 2007 |
Component Shift During Reflow
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Oct 2, 2007 |
Chemical composition of flux?
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Oct 1, 2007 |
Clean before wave soldering
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Sep 23, 2007 |
Coating or encapsulating tin-lead solder joints?
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Jul 30, 2007 |
SMT Epoxy for lead-free wave
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Jul 30, 2007 |
What exactly is intermetallic spalling?
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Jun 18, 2007 |
Tombstone problems
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Jun 11, 2007 |
Using tin-lead solder on RoHS parts
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May 7, 2007 |
Wave Solder fluxing
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Apr 23, 2007 |
Soldering reliability using SAC 305...
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Apr 15, 2007 |
Using non-RoHS components in RoHS
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Nov 28, 2006 |
Flux residue after baking
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Nov 28, 2006 |
Halogen Free PCB legislation
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Nov 27, 2006 |
Reflow oven profiles
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Nov 27, 2006 |
Wave soldering lead-free components
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Nov 6, 2006 |
Tombstone problems
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Oct 23, 2006 |
Reflow Oven Profilers
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