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Bill Coleman |
Member No. 40912 |
Vice President Technology
Photo Stencil
bcoleman@photostencil.com
 For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products such as trapezoidal chem-etch apertures, wafer bumping stencils and DuraGlide squeegee blades.
Experts Questions Answered by Bill Coleman
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Aug 4, 2008 |
Reflow BGA's with CSP's
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Jul 21, 2008 |
BGA Rework
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May 12, 2008 |
Solder bridging on BGA's
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Mar 3, 2008 |
Type IV solder paste on 0201
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Dec 3, 2007 |
Part Movement During Reflow
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Sep 17, 2007 |
BGA Rework - with or without solder paste
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Jul 16, 2007 |
SMT adhesive problems after wave solder process
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Jul 2, 2007 |
BGA re-balling process
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Jun 18, 2007 |
Tombstone problems
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Jun 4, 2007 |
Stencil printing process problems
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Apr 30, 2007 |
Through-hole ratios for PCB's
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Mar 4, 2007 |
Lead-free bar solder for wave soldering
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Feb 4, 2007 |
Screen printing QNF24 problem
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Jan 29, 2007 |
Lead-free soldering problem
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Sep 25, 2006 |
0201 capacitors creating process problem
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Sep 11, 2006 |
Reflow of "high-lead" flip chip device
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Aug 21, 2006 |
Problems with solder paste stencils
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Jul 10, 2006 |
Can we convert our existing wave soldering machine to use lead free?
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May 10, 2006 |
Problems with defect BGA connections on large BGA's and on ENIG plated boards
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Apr 13, 2006 |
Advise and suggestions for assembly using 01005 capacitors.
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