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May 29, 2006
Difference between ENIG and Flash?
With PCB plating what’s the difference between ENIG and Flash?
Mike Johnson
SoPark Corp
This "Ask the Experts" page has been viewed 1121 times.
Ask the Experts Comments
May 29, 2007
You are comparing apples to oranges. ENIG describes materials (nickel and gold) and processes (electroless for nickel and immersion for gold). Flash describes the plating thickness. Flash typically means a very thin (3 to 10 microinches) coating of gold, regardless of the process. Therefore, flash gold could be electrolytic, electroless, or immersion. Initial problems with flash gold in the 1990’s tend to refer to an electroless process used over separable connectors that resulted in galvanic-driven pore corrosion.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
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