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April 2, 2007
Cleaning tin-lead and lead-free boards
We are creating our first lead-free SMT assembly line and have new equipment for this area and expect low volume to start. We had not planned on buying new board cleaning equipment.
Can we use the same cleaning equipment for tin-lead and lead-free boards?
T.A.
This "Ask the Experts" page has been viewed 1133 times.
Ask the Experts Comments
April 2, 2007
The only thing that would force a user into unique cleaners for leaded and lead-free assemblies would be if the lead from the leaded cleaning process could somehow contaminate the lead-free assemblies.
Since the level of lead leached into the water is extremely low (and could be filtered out), there should be no issue with using the same cleaning equipment for leaded and lead-free assemblies.
There is no chance that lead contamination from the cleaning process could elevate a lead-free board up to the 0.1% RoHS limit for lead-free assemblies.
Brian Smith, Global Sales & Marketing Manager
Kester Paste
bsmith@kester.com
Mr. Smith is the Global Sales & Marketing Manager for Kester and has worked in the soldering materials industry since 1994. He holds a B.S. degree in Chemical Engineering from the University of Illinois and has an intensive background in soldering materials technology and SMT process optimization. He has visited hundreds of electronics assembly companies globally and has assisted many customers with lead-free qualification and conversion efforts. He has achieved Certified Process Engineer status through the SMTA.
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April 2, 2007
You can use the same equipment for eutectic and lead free, given that the chemistry you choose has the capability of separating tin-organic compounds from the cleaning bath.
We recently published a paper on exactly this problem, and you can find that on our website.
Dr. Harald Wack, Executive Vice President and CEO
Zestron America
Harald Wack is a graduate of Johns Hopkins University with a doctoral degree in organic chemistry, an author of 10+ published scientific articles in organic chemistry (asymmetric catalysis) as well as numerous publications within the electronics industry. Prior to working for Zestron America, Dr. Wack has held several management positions within and outside the electronics industry. He is currently the Executive Vice President and CEO of Zestron America.
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April 2, 2007
The answer depends entirely on the specific cleaning system you are currently using.
Lead free is more difficult to clean than lead alloys. To overcome the increased difficulty, more cleaning power is utilized. Power is defined as "impact pressure", "water particle diffusion angles", "heater wattage", etc.
Older defluxing systems most likely lack sufficient power to handle the increased "metal salts" created by the elevated temperature profiles required by most lead free alloys. The result may be increased white residue and flux left on the board's surface.
Additionally, some chemical companies have recently introduced advanced chemical formulations specifically designed for lead-free residue removal. These advanced chemicals may or may not be compatible with older defluxing systems. Check with the equipment’s manufacturer to brand-specific advice.
Mike Konrad, President
Aqueous Technologies
konrad@aqueoustech.com
Mr. Konrad has been in the electronic assembly equipment industry since 1985. Michael is founder and CEO of Aqueous Technologies Corporation, a California based manufacturer of automatic de-fluxing equipment, chemicals, and cleanliness testing systems. He is a member of SMTA and IPC. He sits on SMT Magazine's Editorial Advisory Board and is a member of the IPC-APEX Tradeshow Exhibitor's Committee.
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April 2, 2007
I think the cleaning guys will say no, but you can run a number of tests to confirm the effectiveness of the old equipment. They would include ion chromatography per IPC-TM-650, a surface insulation resistance (SIR) / electrochemical migration (ECM) type test on a test coupon (such as IPC-B-25), and a final confirmation through temperature/humidity testing of the actual product.
With product testing, I often recommend a modified THB test, consisting of two conditions (40/93 and 65/88) for three to five days each. Of course, if you conformally coat or this is a risk of condensation, different tests are required.
Dr. Craig D. Hillman, CEO & Managing Partner
DfR Solutions
chillman@dfrsolutions.com
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology and printed board failure mechanisms. Dr. Hillman has over 30 publications and has presented on a wide variety of reliability issues to over 150 companies and organizations.
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April 2, 2007
Can the same equipment be used to clean Lead-free types of fluxes? The answer is yes, but the process parameters will have to be checked to make sure the residues are in fact removed with the new chemical lead-free process.
The cleaning process will have to be evaluated to make sure the soak time, rinse time and dry time are defined to clean off the new flux residues. Cleaning tests could include either the dynamic or static ionic cleanliness tester, but I would recommend using a Surface Insulation Resistance Test (SIR) to verify the goodness of the cleaning process in removing the processed flux residues.
Leo Lambert, Vice President, Technical Director
EPTAC Corporation
leo@eptac.com
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee, covering areas of mounting, soldering, solderability and assembly.
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