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May 29, 2007
ICT testing after assembly
Is there any efficient testing method for ICT testing after assembly?
The surface finishing is OSP. Will this induce poor contact for the probes on the test point?
What kind of test probes can we select to improve first pass yield?
MingWang Lee
CBD
This "Ask the Experts" page has been viewed 686 times.
Ask the Experts Comments
May 29, 2007
For In-Circuit Test (ICT), an OSP finish on conventional test pads is a source of connectivity problems where test probes sometimes have trouble getting good contact. To avoid this, one consideration would be utilizing Bead Probe Technology as an alternative.
More details on how bead probes can be of benefit can be found on our website.
Stacy Kalisz Johnson, Americas Marketing Development Manager
Agilent Technologies
stacy_johnson@agilent.com
 Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. With a strong process background, Stacy transitioned to the test and measurement equipment world in 2000. Stacy was an Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) Product Manager for several years, respectively. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
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