Circuitnet Logo
   We search for industry news, so you don't need to.
 
Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Experts  I  Equipment  I  Circuitmart  I  Calendar





Ask the Experts Submit A Question  |   Index  |   Panel
July 2, 2007

Any "Standards" on pad repairs?

Is there anything in IPC or other Industry Standard that would indicate the number of pads that can be replaced and/or repaired on a multi-leaded component in a single instance? This would include epoxy as well as thermbond pad repairs.

Sherri Dobroskay
Vecima Networks Inc.

This "Ask the Experts" page has been viewed 707 times.

Ask the Experts Comments

July 2, 2007

A board needing to be repaired needs to be approved by the customer as it will not meet the requirements of the initial document.

Per 7711, “Repairs are generally changes to an unacceptable end product to make it acceptable in accordance with original functional requirements. The control of repaired products should be by means of Material Review Board (MRB), or its equivalent, which may consist of Design Engineering, Quality Assurance, and User representatives.

The MRB, with technical support, should define the mutually acceptable repair method to be used and take the action necessary to ensure that all applicable procedures are adhered to. ….. the maximum number of repairs per printed wiring board assembly should be determined by the using activity or agency.”

So how many pads can be replaced, as many as the customer will allow and still have a reliable product.

The other consideration is the cost of the product and the availability of meeting the time requirements to deliver the product to the customer. All these may be involved in the decision making process of repairing or replacing the product.

Leo Lambert, Vice President, Technical Director
EPTAC Corporation
leo@eptac.com

Leo LambertAt EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee, covering areas of mounting, soldering, solderability and assembly.







Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Ask the Experts  |   Calendar  |   Corporate News  |   Contact Us
Free Subscription  |   Industry Forums  |   Equipment Mart  |   Exclusives  |   Letters  |   Circuitmart  |   News  |   Site Map  |   Viewpoint  |   White Papers


Search Category       Search Term   
To search a phrase, place it in quotes.
We search for industry news so you don't need to.

Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA
Copyright © 2008 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager

Visit Semiconductor Packaging News for the latest semiconductor and advanced packaging news and information.