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White Paper Submission Guidelines
The daily Circuitnet e-mail newsletter and web site reaches over 300,000 industry professionals involved in electronics manufacturing and assembly.
If you have a technical white paper, post at no cost for readers to learn more about your technology.
White Paper Submit Form
Our readers are interested in technical solutions to the issues faced by electronics assembly industry professionals. White Papers should not promote the sale of a product or service.
Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better.
White Papers should be submitted as PDF files less than 2 Megs.
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Basics of Ball Grid Arrays (BGAs)
Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA)is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs,their use and fan out techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs.
Advanced Assembly
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