White Paper Download Index Semiconductor Grade Fluxes for Copper Pillar Flip-Chip As the semiconductor assembly industry continues its movement toward finer pitch, combined with reduced copper pillar height, cleaning processes are increasingly difficult. In response, this paper discusses the benefits of using semiconductor-grade ultra-low residue no-clean fluxes. Indium Corporation Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1516 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.