White Paper Download Index SMQ75--A No-Clean Die-Attach Solder Paste for Clip-Bonding Learn how Indium Corporation studied the effects of alloy type, powder size, and metal loading to create guidelines leading to higher yield, while maintaining satisfactory placement and reflow characteristics in the assembly of high-current-density discrete power devices. Indium Corporation Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1642 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.