White Paper Download Index High Capability Die Attach Film for Small Die Applications Die attach pastes often can't facilitate the emerging requirements of small die packages. Find out how new non-conductive die attach films are enabling production and reliability of these devices. Henkel Electronics Materials, LLC Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 2150 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.