White Paper Download Index How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects New paper explores best practices for ultrasonic testing examines wafer bonding technologies and the non-destructive testing methods. Paper explores ultrasonic testing frequencies, focal lengths and wafer inspection techniques to deliver optimum precision and clarity for each bond type and structure. Sonix, Inc Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 553 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.