White Paper Download Index Plasma Clean to reduce Wire Bond Failures A Plasma process prior to wire bonding will always deliver a cleaner surface to bond to. Potential benefits are improved wire bond statistics, improved device reliability, and the elimination of excursions caused by non-systemic influences Nordson MARCH Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1132 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.