White Paper Download Index PoP Package Warpage Contributors' Characterization & Impact Analysis Due to the shorter schedule demand of configuration's development and execution, the development process to identify an optimized PoP bottom package cannot take the traditional way of multiple iterations through large scale; time consuming and complex DOE's. Amkor Technology, Inc. Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 1606 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.