White Paper Download Index Die Attach Voiding Requirements in Eutectically Bonded GaAs and GaN MMIC Power Amplifiers This WHITE PAPER will briefly review the eutectic die attach process, existing Mil-Std-883 die voiding specifications, along with additional concerns and reliability issues related to high-frequency/high-powered MMIC die attach. TJ Green Associates LLC Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load. Page views: 715 White Paper Submission Guidelines - White Paper Submit Form Semiconductor Packaging News reaches industry professionals involved in semiconductor packaging and microelectronics. If you have a technical white paper, post at no cost for readers to learn more about your technology. Our readers are interested in technical solutions. White Papers should not promote the sale of a product or service. Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better. White Papers should be submitted as PDF files less than 2 Megs.