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White Paper Submission Guidelines
The daily Circuitnet e-mail newsletter and web site reaches over 300,000 industry professionals involved in electronics manufacturing and assembly.
If you have a technical white paper, post at no cost for readers to learn more about your technology.
White Paper Submit Form
Our readers are interested in technical solutions to the issues faced by electronics assembly industry professionals. White Papers should not promote the sale of a product or service.
Please limit your White Paper length to 5 pages or less. Keep the reader in mind - shorter is always better.
White Papers should be submitted as PDF files less than 2 Megs.
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Minimize Solder Extrusions
During component rework, adjacent underfilled devices may be subjected to temperatures above the solder melt point. This can create a path for solder extrusion and result in open joints. Find out how optimized underfill formulas can eliminate solder extrusions during rework.
Henkel Electronic Materials LLC
Complete the form below. After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.
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