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An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies

Conventional Electroless Nickel/Immersion Gold (ENIG) is prone to black-pad defects (hyper-corrosion failures) and brittle solder joint failures which lead to reliability concerns of electronic assemblies. The novel ENIG eliminates black pad defects, achieves robust solder joints and provides improved quality-reliability of electronic assembly.

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