We search for industry news, so you don't need to.
News | Search | Subscribe
White Paper Index  

TLS-Dicing: A Novel Laser-based Dicing Approach for Silicon Carbide Power Devices

This paper shows the potential of TLS-Dicing for SiC-based power devices. Separation by using TLS-Dicing results in a high yield count in combination with very high edge quality. The dicing costs per wafer were significantly reduced.

3D-Micromac AG

Complete the form below to download this White Paper.
After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.