We search for industry news, so you don't need to.
White Paper Index  

Elimination of Mid-Chip Solder Balls

Find out what aperture design and highly-capable solder paste can do to get rid of mid-chip solder balls, a defect seen most frequently with chip resistors, but one that may also occur with capacitors. Read the results of the study.

Henkel Electronics Materials, LLC

Complete the form below to download this White Paper.
After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.