We search for industry news, so you don't need to.
News | Search | Subscribe
White Paper Index  

New Backside Protection Film Boosts WLCSP Reliability

Reduce mechanical damage, improve laser marking performance and eliminate mold compound processes with a new film that enables high-yield production of miniaturized (< 3 mm x 3 mm) WLCSP devices. Learn more.

Henkel Electronics Materials, LLC

Complete the form below to download this White Paper.
After you hit submit you will be redirected to the White Paper page. Please be patient, it may take a few seconds for the White Paper to load.